Semiconductor & vacuum fabrication

Electropolishing Services for Stainless Steel Vacuum Components

In-house electropolishing to Ra < 0.4 µm — the step that decides whether a chamber reaches UHV or stalls at high vacuum.

Electropolishing is not a cosmetic finish. On a vacuum chamber it removes the mechanically deformed surface layer, strips embedded iron and sulphur, and cuts the real surface area that traps water vapour. A chamber that outgasses will never hold UHV no matter how good the welds are.

Why electropolishing matters for vacuum, not just for looks

Mechanical polishing smears metal rather than removing it, leaving a Beilby layer of deformed material with embedded contamination. That layer is a reservoir of hydrogen and water vapour. Electropolishing dissolves it anodically, typically removing 20–40 µm, and leaves a chromium-enriched passive surface. The result is a lower real-to-apparent surface area ratio, faster pump-down, and a lower ultimate pressure.

What we control in-house

Electropolishing and passivation are done at our own facility rather than subcontracted. That matters for two reasons: the finish is part of the dimensional and cleanliness chain, so it cannot be handed to a third party without losing traceability; and when a chamber needs rework after leak testing, the turnaround is days rather than weeks.

Typical specification we work to

Ra < 0.4 µm on internal wetted surfaces, 20–40 µm material removal, uniform current density on complex geometry, and post-treatment rinse and dry to prevent residue staining. Internal weld caps are ground flush before polishing so the electropolish does not exaggerate a step at the seam.

Materials

304, 304L, 316, 316L and 316LN stainless steel, plus aluminium alloys where the customer specifies a chem-film or anodised route instead. 316L is the default for UHV semiconductor chambers; 316LN is specified when the application needs low magnetic permeability.

Reference table

Surface finish against typical vacuum performance

Internal surface treatmentTypical RaTypical ultimate pressureOutgassing behaviour
As-welded, no treatment3–6 µmHigh vacuum onlyHigh — weld oxide and embedded contamination
Mechanical polish0.8–1.6 µmHigh vacuum (HV)Moderate — smeared layer retains water vapour
Glass-bead blast + clean1.0–2.0 µmHV to UHV with bake-outModerate — depends on bead grade and rinse
Electropolished< 0.4 µmUHV with bake-outLow — deformed layer removed, Cr-enriched surface
Electropolished + 400 °C bake< 0.4 µmUHV, lowest achievableLowest — surface water driven off before sealing

What we control in-house

Frequently asked questions

What does electropolishing do to a vacuum chamber?

It anodically dissolves 20–40 µm of the surface, removing the deformed layer left by machining and mechanical polishing. That layer stores water vapour and hydrogen; removing it lowers outgassing and lets the chamber reach UHV after bake-out.

How much does electropolishing reduce outgassing?

It is the surface layer, not the bulk material, that drives outgassing. Removing the deformed layer and enriching the surface in chromium typically reduces the water-vapour desorption rate by an order of magnitude — which is the difference between pumping down in hours and pumping down in days.

Do you electropolish in-house?

Yes. Electropolishing and passivation are performed at our own facility, so finish, dimensional verification and leak testing stay in one traceable chain and rework does not add a subcontractor lead time.

Can you electropolish large chambers?

Yes — our gantry machining envelope is 12 m × 4 m × 2 m, and electropolishing is sized to match, so large weldments do not have to be split for finishing.

Is electropolishing the same as passivation?

No. Passivation removes free iron from the surface chemically but does not remove the deformed layer. Electropolishing removes material and levels the surface. For UHV work you normally want electropolishing, optionally followed by a passivation rinse.

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