What is in it
- ›Surface finish against achievable vacuum
A comparison of as-welded, mechanically polished, bead-blasted and electropolished surfaces against the vacuum each can realistically reach. - ›Leak rate: what each test method resolves
Detection limits for bubble, pressure-decay, helium sniffer, helium bombing and integral in-vacuum testing — and what each method cannot tell you. - ›Bake-out temperature selection
How to choose between 150 °C, 250 °C and 400 °C depending on the seal and braze materials in the assembly. - ›Flange family selection
ConFlat, KF/NW, ISO-K and ISO-F compared on sealing method, pressure range, bake-out limit and gasket reuse. - ›Material properties reference
Melting points and specific gravities for the metals commonly encountered in vacuum component design. - ›The fabrication sequence
Why the order — weld, stress relieve, machine, electropolish, leak test, bake — cannot be rearranged without losing the result. - ›In-house capability list
Exactly what is done at our own facility, including electropolishing and passivation. - ›A representative semiconductor project
800 mm aluminium etch chambers held to 0.015 mm flatness and 1 × 10⁻⁹ mbar·l/s, on a 50+ chamber per year supply agreement.
Who this is for
Design engineers specifying a vacuum chamber or an upgrade, and procurement engineers who need to compare quotations on something other than price. The tables give you the acceptance criteria to put in the specification.
Need a chamber built to this specification?
Send the drawing or the specification and we will come back with a DDP price, lead time and inspection plan.